Congratulations
to the new 2020-2021
OSSC Board of Directors!

In Memorium

Images Newsletter

The June 2020 Edition of OSSC's Images eNewsletter is now available.

Professional Education

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Upcoming VOSA Meeting

by
Donald Pearson II, Äpre Instruments

Abstract:  Conventional interferometry is widely used to measure spherical and flat surfaces with nanometer level precision but it is often plagued by back or multiple surface reflections.  At this meeting a new method of isolating the measurement surface by controlling the spectral properties of the source will be described (Spectrally Controlled Interferometry - SCI).  Using spectral modulation of the interferometer's source enables formation of localized fringes where the optical path difference is non-zero.  As a consequence, it becomes possible to form white-light like fringes in common path interferometers, such as the Fizeau or Twyman-Green.  ÄPRE’s SCI technology does not require mechanical phase shifting, resulting in simpler instruments and offers the ability to upgrade existing interferometers.  Furthermore, SCI allows absolute measurement of distance, including radius of curvature of lenses, in a single setup with the possibility of improving the throughput and removing some of the pitfalls of inaccurate measurements.

by
Alexander Fast, Ph.D., UC Irvine
Beckman Laser Institute & Medical Clinic
Nonlinear Optical Microscopy Lab

Abstract:  Multiphoton imaging of human skin provides access to morphological information with molecular contrast obtained in a noninvasive manner.  Our group at Beckman Laser Institute pioneered the clinical skin imaging with multiphoton microscopy.  This talk will present the latest developments on the new generation multiphoton microscopy imaging platform for efficient integration into clinical setting.

by
Scott Jordan, PI (Physik Instrumente)

Abstract:  In Silicon Photonics and other precision optical fields, production quantities have exponentiated and competition has intensified over the past few years.  In multiple test and packaging steps, submicron-scale alignments are necessary and dominate overall production costs.  These commence with optically and electronically probing devices while still on the wafer, and the alignments must be repeated through final packaging and all the intermediate steps in between.

The key is leveraging optical physics to separate dependence on position commandability.  A universal implementation is now commercially available and fab-proven.  Process cost reductions of 99% are seen.  We will discuss this technology and its applications, and a live demonstration of parallel array I/O alignment will be offered.

see also:  https://www.pi-usa.us/en/tech-blog/history-and-future-of-photonics-alignment-automation-test-assembly-of-sip-components/