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HomeEventsOSSC March Joint Meeting with OSA - Scott Jordan from Physik Instrumente

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OSSC March Joint Meeting with OSA - Scott Jordan from Physik Instrumente

When:
Wednesday, March 22, 2017
Where:
Los Angeles Convention Center
Los Angeles Convention Center
1201 South Figueroa Street
Los Angeles, CA  90015
Additional Info:
Event Contact(s):
Nicholas J Croglio, Jr.
Category:
OSSC Regular Meeting
Registration is required
Payment in Full In Advance Or At Event
Cancellation Policy:
Please let the Arrangements Chair (Events@ossc.org) know as soon as possible.

Payments made in advance will normally be issued a credit that may be applied to future payments (membership or events). Please contact the Treasurer (Treasurer@ossc.org) if this posses a significant burden.
Activities/Items    (Click the down-arrow to the left of the activity/item to view the details)
Presentation
Dinner
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Donate to the OSSC (Suggested Donation)
Nano-alignment as challenge and enabler for “Silicon Photonomics”
Scott Jordan
Head of Photonics,  Physik Instrumente

PI SF-450

Co-Sponsored by OSA as part of the Optical Fiber Communications (OFC) Conference

Abstract: 
Engineers are confronted with challenges in planning for repetitive manufacturing of Silicon Photonics devices: needed is fast, nanoscale alignment of optical fibers, small optical elements and the actual SiP devices in test and packaging.  These cannot be aligned adequately via passive approaches or using machine vision, and drift must often be corrected in real time.  Prior approaches have not been suitable for the multiple, interacting inputs and outputs commonly encountered in today’s SiP devices, nor was their speed sufficient for economic application in these applications.

We provide a concise review of prior approaches and discuss their applicability and shortcomings in the face of today’s emerging SiP architectures.  The unmet challenges have led to the introduction of a novel, multichannel-capable active alignment technology that has been integrated into wafer probers and volume packaging systems.  It performs global optimization across the inputs and outputs of complex SiP devices in one rapid step, facilitating functional and parametric testing and packaging operations with high throughput.  Speed improvements can exceed two orders of magnitude.

Venue:  Los Angeles Convention Center
Room: Club Lounge
1201 South Figueroa Street 
Los Angeles, California 90015

 Reception with light hors d'oeuvres:
$25 ($30 after 15 March)
OSSC Student Members $10 ($15 after 15 March)

Presentation without reception is FREE, but registration required

Parking: On your own (South Hall lot is convenient)

Please Register by Wednesday 15 March 2017

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TustinCalifornia  92782
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